Friday, 31 October 2014

GRAPHENE updates by (NTNU) Norway

Mobile phones that bend, self-powered nano devices, new and improved solar cell technology and windows that generate electricity are but a few of the potential products from the union of semiconductors and graphene.
Semiconductors grown on graphene at the Norwegian University of Science and Technology (NTNU) may be the most important research breakthrough of 2012 in Norway. At the centre of the research efforts are Professor Helge Weman, Professor Bjørn-Ove Fimland and post-doctoral fellow Dong Chul Kim. The team is now working on translating the results of their basic research into an initial prototype.
Just one atom thick
In the 1960s, researchers envisioned that graphite (pure carbon) could be cut into layers measuring only one atom in thickness -- resulting in the material known as graphene.
In the 1990s, researchers managed to create a layer as thin as 100 atoms, but there was no progress after that until 2004, when Russian-born Andre Geim grabbed a tape dispenser from his desk at the University of Manchester, pressed a bit of tape over a thin layer of graphite and peeled it away. When he examined the tape under a microscope, he discovered a layer only one carbon atom thick. Graphene was born!
In 2010, Dr Geim and his colleague, Konstantin Novoselov, were jointly awarded the Nobel Prize in Physics for their work in demonstrating the unique properties of graphene.
Ahead of the pack at NTNU
Six months before Dr Geim and Dr Novoselov arrived in Stockholm to receive their prize, and before graphene had become an item of interest, South Korean post-doctoral fellow Dong Chul Kim at NTNU had suggested to Professors Helge Weman and Bjørn-Ove Fimland at the Department of Electronics and Telecommunications that they should take a closer look at precisely this material. The suggestion came shortly after a research group in their department had succeeded in growing semiconductor nanowires made of gallium arsenide (GaAs) on silicon substrates. This led Dr Weman to wonder if it would be possible to grow semiconductor nanowires directly on graphene instead.
The collective expertise of Professor Weman, Professor Fimland and Dr Kim proved to be a fruitful combination. The researchers quickly achieved their first breakthrough, in September 2010, and in the summer of 2012 they succeeded in placing nanowire semiconductors on a one-atom-thick base. These active semiconductors normally grow to be one micron (a millionth of a metre) in thickness.
Will silicon become obsolete?
Graphene is definitely the hottest topic right now among nanomaterial researchers. The pure-carbon material is by far the thinnest and strongest known to exist. It is 200 times stronger than steel, conducts electricity 100 times faster than silicon and is superior to any other material in conducting heat. It is impenetrable, yet pliable and transparent at the same time. And inexpensive large-scale production of graphene is now becoming a reality.
At present, electronics and solar cells are placed on top of thick silicon substrates. But silicon has clear limitations, including size. Large technology companies are struggling to produce silicon-based products that are smaller than those currently on the market. Another challenge with using silicon is that silicon-based electronics generate a great deal of heat. Many people consider graphene to be the prime candidate for replacing silicon.
Large multinational corporations such as IBM and Samsung have poured a lot of effort into research on both semiconductors and graphene. But the real breakthrough in growing semiconductors on graphene actually took place at NTNU in Trondheim.
The findings of these researchers in Trondheim can be used to make electronics and solar cells that are several hundred times thinner than current models. This will make it possible to produce electronics that are both pliable and transparent, in addition to being less expensive and more energy-efficient.
More efficient solar cells and LEDs
It will probably not be long before simple graphene products begin appearing on the market. Some of them will be based on semiconductor technology.
Semiconductors are a main component in almost all modern electronics. Without them, it would not be possible to have computers, smartphones, solar cells, LED lights or devices using lasers, i.e. everything from printers to fibre communications. All these items can be made smaller and better using graphene. Graphene can both supplant the semiconductor substrate and serve as a transparent electrode for a pliable nanowire solar cell.
"Solar cell and LED technology will be the initial areas to see new products using graphene-based semiconductors," Dr Weman believes.
Under-priced fossil-fuel energy is the primary contributor to global warming. Sunlight is an alternative source with enormous potential, but solar energy will have to become less expensive and more efficient. Semiconductor nanowires based on graphene may just finally tip the scales in favour of solar energy.
"If semiconductor nanowires grown on graphene are used in solar cells, the same amount of sunlight can be converted to energy using one-tenth the volume of materials used in thin-film solar cells. And that means we've cut down on even more material by growing the semiconductors on graphene instead of on a thick semiconductor substrate. New research also shows that graphene has additional unique properties that enhance the efficiency of a solar cell," Dr Weman explains.
LED light bulbs are superior in terms of energy efficiency, but have been more expensive to produce because of costly semiconductor substrates. Semiconductor nanowires on graphene will make it possible to supply the world with LED bulbs that are far cheaper and much more efficient while also being more pliable and weighing less than today's bulbs.
Industrialisation on the horizon
The work on graphene at NTNU has drawn the attention of many international companies interested in collaborating with the Trondheim-based researchers and their company, CrayoNano. But the potential industrial queries so far have come solely from Asia and the US. Actors in Norway and Europe have yet to express any interest.
"We are pioneers in that we are using graphene for something other than basic research. We may already have our first prototype in place by the end of 2013, but we don't wish to reveal what it is yet," Dr Weman says.
"The field we are working with -- using graphene as a replacement for silicon and other semiconductor substrates in electronics and solar cells -- entails many new opportunities. But the potential is just as great for applications using graphene in areas other than electronics, such as in the medical sector. Graphene can be used in the body without causing any harm," Dr Weman explains.
"In a world where drinking water is in short supply, employing oxygen-modified graphene filters to purify water is yet another exciting application. It's a whole new way to turn seawater into fresh water."
In any case, research and development activities will be needed for many years. Dr Weman likens the current state of graphene research to where silicon was in the early 1960s.
Research Council funding paved the way
The Research Council of Norway has been a key source of funding for the Trondheim-based researchers throughout. Helge Weman makes it clear that funding under the Commercialising R&D Results (FORNY2020) programme and the Funding Scheme for Independent Basic Research Projects (FRIPRO) is what made it possible to achieve the unexpected research breakthrough. The researchers have also benefited significantly from funding allocated under the Research Programme on Nanotechnology and New Materials (NANOMAT) and the Large-Scale Programme Clean Energy for the Future (RENERGI).
The professor points out that NTNU's strategic initiative on nanotechnology launched in 2005 is a good example of what future-oriented research policy can help to achieve.
A three-minute video on is available on YouTube in which Helge Weman explains this research: http://www.youtube.com/watch?v=3wLOXHRVVw
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Thursday, 30 October 2014

Unix/Linux Command Reference

Unix/Linux Command Reference
File Commands
1. ls                         Directory listing
2. ls –al                   Formatted listing with hidden files
3. ls -lt                    Sorting the Formatted listing by time modification
4. cd dir                  Change directory to dir
5. cd                       Change to home directory
6. pwd                    Show current working directory
7. mkdir dir            Creating a directory dir
8. cat >file         Places the standard input into the file
9. more file             Output the contents of the file
10. head file           Output the first 10 lines of the file
11. tail file              Output the last 10 lines of the file
12. tail -f file         Output the contents of file as it grows, starting with the last 10 lines
13. touch file         Create or update file
14. rm file              Deleting the file
15. rm -r dir           Deleting the directory
16. rm -f file           Force to remove the file
17. rm -rf dir           Force to remove the directory dir
18. cp file1 file2     Copy the contents of file1 to file2
19. cp -r dir1 dir2   Copy dir1 to dir2;create dir2 if not present
20. mv file1 file2    Rename or move file1 to file2,if file2 is an existing directory
21. ln -s file            link Create symbolic link link to file

Process management
1. ps                      To display the currently working processes
2. top                     Display all running process Unix/Linux Command Reference
3. kill pid               Kill the process with given pid
4. killall proc         Kill all the process named proc
5. pkill pattern       Will kill all processes matching the pattern
6. bg                      List stopped or background jobs,resume a stopped job in the  background 
7. fg                       Brings the most recent job to foreground
8. fg n                    Brings job n to the foreground


File permission
1. chmod octal file Change the permission of file to octal,which can be found separately for user,group,world by adding,
• 4-read(r)
• 2-write(w)
• 1-execute(x)


Searching
1. grep                        pattern file Search for pattern in file
2. grep -r                    pattern dir Search recursively for pattern in dir
3. command | grep :   pattern  Search pattern in the output of a command
4. locate file               Find all instances of file
5. find . -name           filename Searches in the current directory (represented by
a period) and below it, for files and directories with names starting with filename 
6. pgrep:                    pattern Searches for all the named processes , that matches with the pattern and, by default, returns their ID



System Info
1. date             Show the current date and time
2. cal               Show this month's calender
3. uptime         Show current uptime
4. w                 Display who is on line
5. whoami       Who you are logged in as Unix/Linux Command Reference 6. finger user                             Display information about user
7. uname -a                   Show kernel information
8. cat /proc/cpuinfo       Cpu information
9. cat proc/meminfo     Memory information 
10. man                        command Show the manual for command
11. df                            Show the disk usage
12. du                           Show directory space usage
13. free                         Show memory and swap usage
14. whereis app            Show possible locations of app
15. which app               Show which applications will be run by default

Compression

1. tar cf file.tar file                    Create tar named file.tar containing file
2. tar xf file.tar                          Extract the files from file.tar
3. tar czf file.tar.gz files            Create a tar with Gzip compression
4. tar xzf file.tar.gz                    Extract a tar using Gzip
5. tar cjf file.tar.bz2                   Create tar with Bzip2 compression
6. tar xjf file.tar.bz2                   Extract a tar using Bzip2
7. gzip file                                  Compresses file and renames it to file.gz
8. gzip -d file.gz                         Decompresses file.gz back to file



Unix/Linux Command Reference Shortcuts
1. ctrl+c                   Halts the current command
2. ctrl+z                   Stops the current command, resume with fg in the foreground or bg in                                  the background
3. ctrl+d                   Logout the current session, similar to exit 
4. ctrl+w                  Erases one word in the current line
5. ctrl+u                   Erases the whole line
6. ctrl+r                   Type to bring up a recent command
7. !!                         Repeats the last command

8. exit                      Logout the current session

Basic Linux Commands

Basic Linux Commands
mkdir - make directories
Usage
mkdir [OPTION] DIRECTORY
Options
Create the DIRECTORY(ies), if they do not already exist.
 Mandatory arguments to long options are mandatory for short options too.
 -m, mode=MODE  set permission mode (as in chmod), not rwxrwxrwx - umask
 -p, parents  no error if existing, make parent directories as needed
 -v, verbose  print a message for each created directory
 -help display this help and exit
 -version output version information and exit
cd - change directories
Use cd to change directories. Type cd followed by the name of a directory to access that directory.Keep in mind that you are always in a directory and can navigate to directories hierarchically above or below.
mv- change the name of a directory
Type mv followed by the current name of a directory and the new name of the directory.
 Ex: mv testdir newnamedir
pwd - print working directory
will show you the full path to the directory you are currently in. This is very handy to use, especially when performing some of the other commands on this page
 rmdir - Remove an existing directory
 rm -r
Removes directories and files within the directories recursively.
chown - change file owner and group
Usage
chown [OPTION] OWNER[:[GROUP]] FILE
chown [OPTION] :GROUP FILE
chown [OPTION] --reference=RFILE FILE
Options
Change the owner and/or group of each FILE to OWNER and/or GROUP. With --reference, change the owner and group of each FILE to those of RFILE.
 -c, changes like verbose but report only when a change is made
 -dereference affect the referent of each symbolic link, rather than the symbolic link itself
 -h, no-dereference affect each symbolic link instead of any referenced file (useful only on systems that can         change the ownership of a symlink)
 -from=CURRENT_OWNER:CURRENT_GROUP
  change the owner and/or group of each file only if its current owner and/or group match those specified here.  Either  may  be  omitted,  in which case a match is not required for the omitted attribute.
-no-preserve-root do not treat `/' specially (the default)
-preserve-root fail to operate recursively on `/'
-f, -silent, -quiet  suppress most error messages
-reference=RFILE use RFILE's owner and group rather than the specifying OWNER:GROUP values
-R, -recursive operate on files and directories recursively
-v, -verbose output a diagnostic for every file processed
The  following options modify how a hierarchy is traversed when the -R option is also specified. If more than one is specified, only the final one  takes effect.
-H     if a command line argument is a symbolic link to a directory, traverse it
-L     traverse every symbolic link to a directory encountered
-P     do not traverse any symbolic links (default)
chmod - change file access permissions
Usage
chmod [-r] permissions filenames
 r  Change the permission on files that are in the subdirectories of the directory that you are currently in.        permission  Specifies the rights that are being granted. Below is the different rights that you can grant in an alpha  numeric format.filenames  File or directory that you are associating the rights with Permissions
u - User who owns the file.
g - Group that owns the file.
o - Other.
a - All.
r - Read the file.
w - Write or edit the file.
x - Execute or run the file as a program.
Numeric Permissions:
CHMOD can also to attributed by using Numeric Permissions:
400 read by owner
040 read by group
004 read by anybody (other)
200 write by owner
020 write by group
002 write by anybody
100 execute by owner
010 execute by group
001 execute by anybody
ls - Short listing of directory contents
-a        list hidden files
-d        list the name of the current directory
-F        show directories with a trailing '/'
            executable files with a trailing '*'
-g        show group ownership of file in long listing
-i        print the inode number of each file
-l        long listing giving details about files  and directories
-R        list all subdirectories encountered
-t        sort by time modified instead of name
cp - Copy files
cp  myfile yourfile
Copy the files "myfile" to the file "yourfile" in the current working directory. This command will create the file "yourfile" if it doesn't exist. It will normally overwrite it without warning if it exists.
cp -i myfile yourfile
With the "-i" option, if the file "yourfile" exists, you will be prompted before it is overwritten.
cp -i /data/myfile
Copy the file "/data/myfile" to the current working directory and name it "myfile". Prompt before overwriting the  file.
cp -dpr srcdir destdir
Copy all files from the directory "srcdir" to the directory "destdir" preserving links (-poption), file attributes (-p option), and copy recursively (-r option). With these options, a directory and all it contents can be copied to another dir
ln - Creates a symbolic link to a file.
ln -s test symlink
Creates a symbolic link named symlink that points to the file test Typing "ls -i test symlink" will show the two files are different with different inodes. Typing "ls -l test symlink" will show that symlink points to the file test.
locate - A fast database driven file locator.
slocate -u
This command builds the slocate database. It will take several minutes to complete this command.This command must be used before searching for files, however cron runs this command periodically  on most systems.locate whereis Lists all files whose names contain the string "whereis". directory.
more - Allows file contents or piped output to be sent to the screen one page at a time
less - Opposite of the more command
cat - Sends file contents to standard output. This is a way to list the contents of short files to the screen. It works well with piping.
whereis - Report all known instances of a command
wc - Print byte, word, and line counts
bg
bg jobs Places the current job (or, by using the alternative form, the specified jobs) in the background, suspending its execution so that a new user prompt appears immediately. Use the jobs command to discover the identities of background jobs.
cal month year - Prints a calendar for the specified month of the specified year.
cat files - Prints the contents of the specified files.
clear - Clears the terminal screen.
cmp file1 file2 - Compares two files, reporting all discrepancies. Similar to the diff command, though the output format differs.
diff file1 file2 - Compares two files, reporting all discrepancies. Similar to the cmp command, though the output format differs.
dmesg - Prints the messages resulting from the most recent system boot.
fg
fg jobs - Brings the current job (or the specified jobs) to the foreground.
file files - Determines and prints a description of the type of each specified file.
find path -name pattern -print
Searches the specified path for files with names matching the specified pattern (usually enclosed in single quotes) and prints their names. The findcommand has many other arguments and functions; see the online documentation.
finger users - Prints descriptions of the specified users.
free  - Displays the amount of used and free system memory.
ftp hostname
Opens an FTP connection to the specified host, allowing files to be transferred. The FTP program provides subcommands for accomplishing file transfers; see the online documentation.
head files - Prints the first several lines of each specified file.
ispell files - Checks the spelling of the contents of the specified files.
kill process_ids
kill - signal process_ids
kill -l
Kills the specified processes, sends the specified processes the specified signal (given as a number or name), or prints a list of available signals.
killall program
killall - signal program
Kills all processes that are instances of the specified program or sends the specified signal to all processes that are instances of the specified program.
mail - Launches a simple mail client that permits sending and receiving email messages.
man title
man section title - Prints the specified man page.
ping host Sends an echo request via TCP/IP to the specified host. A response confirms that the host is operational.
reboot - Reboots the system (requires root privileges).
shutdown minutes
shutdown -r minutes
Shuts down the system after the specified number of minutes elapses (requires root privileges). The -r option causes the system to be rebooted once it has shut down.
sleep time - Causes the command interpreter to pause for the specified number of seconds.
sort files - Sorts the specified files. The command has many useful arguments; see the online documentation.
split file - Splits a file into several smaller files. The command has many arguments; see the online documentation
sync - Completes all pending input/output operations (requires root privileges).
telnet host - Opens a login session on the specified host.
top - Prints a display of system processes that's continually updated until the user presses the q key.
traceroute host - Uses echo requests to determine and print a network path to the host.
uptime - Prints the system uptime.
w - Prints the current system users.
wall - Prints a message to each user except those who've disabled message reception. Type Ctrl-D to end the message.

Latch-up

Latch-up in CMOS Integrated Circuits

Latch-up in CMOS Integrated Circuits
 Introduction
            In CMOS fabrication, latch-up is a malfunction which can occur as a result of improper design. Latch-up in a CMOS integrated circuit, causes unintended currents will possibly resulting with the destruction of the entire circuit, thus, it must be prevented.
 Explanation of the phenomena
            Figure 1 shows the cross section of a two-transistor CMOS integrated circuit where the nMOS is on the left hand side and the pMOS on the right hand side. As it can be seen from the figure, we can talk about a parasitic pnp transistor from source of the pMOS to the p-substrate. Furthermore a parasitic npn transistor is formed from source of the nMOS, p-substrate and the n-well. These parasitic transistors and finite resistances of n-well and p-substrate can be shown like Figure 2 [1]. Equivalent circuit of these parasitic bipolar transistors is given in Figure 3 [1].

            Figure 1 Cross section of a CMOS IC
figure 1

Figure 2 Parasitic bipolar transistors in a CMOS process
figure 2

            Figure 3 Equivalent circuits formed by the parasitic transistors
Figure 3

            As it can be clearly seen from the equivalent circuit, there is a positive feedback loop around Q1 and Q2. If a parasitic current flows through the node X and raise Vx, Q2 turns on and IC2 increases resulting VY decrease. This increases IC1 and consequently Vx increases much more. If the loop gain is equal to or greater than unity, this situation continues until an enormous current flow through the circuit in other words, until the circuit is latched up. [1]
Preventing Latch-up
            As explained above, the loop gain of the equivalent circuit shown in Figure 3 should be lesser then unity in order to prevent latch-ups. Consequently, both of process and design engineers should take steps for latch-up prevention.  Doping levels, and the other design aspects should be arranged properly in order to have low parasitic resistances and current gain of bipolar transistors. There are specific design rules to prevent latch-ups in different technologies [1].
Conclusion
            As its results may be fatal for the circuit, preventing latch-up in CMOS integrated circuit design is essential for a proper operation.
 References
            [1] Razavi, B., 2000, Design of Analog CMOS Integrated Circuits, p. 628

Intel's Broadwell processor revealed

Intel's Broadwell processor revealed


The 14-nm Core M aims to upend the tablet market
 


INTEL HASN'T TAKEN TOO kindly to the revolution in mobile devices that has happened largely without its participation. The rise of smartphones and tablets with ARM-compatible chips onboard has become a major threat to Intel's dominance in the processor business—and this is, after all, a company built on the mantra that "only the paranoid survive."
Thus, for several technology generations, Intel has slowly adjusted its heading to better compete in mobile devices. The firm has used its expertise in chip manufacturing and design to cram PC-like performance into ever smaller footprints. Last year's Haswell chip brought huge progress in terms of power consumption, battery life, and system sizes. This year, a new processor code-named Broadwell promises dramatic gains once again, thanks in part to the world-class nanoscale technology in Intel's 14-nm chip fabrication process.
The first Broadwell-based processors will carry a new brand name, Core M, and they will target very small systems indeed: iPad-like tablets that are less than nine millimeters thick and have no fans to cool them. Fitting a PC-class processor into such a device is no easy task. Intel claims to have achieved this feat by tweaking nearly every part of the Broadwell silicon and surrounding platform in order to reduce its size and power consumption. More impressively, they say they've kept performance steady at the same time.
Enforcing Moore's Law: Intel's 14-nm process
One key ingredient in Broadwell's success is Intel's 14-nm manufacturing process, the world's first of its kind. Broadwell has been very publicly delayed due to some teething problems with this new process. In a briefing last week, however, Intel VP and Director of 14-nm Technology Development Sanjay Natarajan told us that the 14-nm process is now qualified and in volume production.
In fact, Natarajan shared quite a few specifics about the 14-nm process in order to underscore Intel's success. His core message: the 14-nm process provides true scaling from the prior 22-nm node, with virtually all of the traditional benefits of Moore's Law intact.
Moore's Law has made the massive advances in microelectronics over the past 40 years possible. Its basic formulation says that the number of transistors one can pack into a given area of a chip will roughly double every couple of years. Intel has moved mountains to keep Moore's Law on track, and it has reaped huge benefits for doing so. The rest of the semiconductor industry has followed the same path, but in recent years, it has done so from a fair distance behind Intel. For instance, this 14-nm process is the second generation to employ what Intel calls tri-gate transistors (which the rest of the industry calls FinFETs). Other firms have yet to ship first-generation FinFET silicon.
Shrinking on-chip features to ever-smaller dimensions is an incredibly difficult problem, and the complexity of the task has grown with each successive generation. When questioned during a press briefing we attended, Natarajan was quick to admit that the familiar naming convention we use to denote manufacturing processes is mostly just branding. The size of various on-chip elements diverged from the process name years ago, perhaps around the 90-nm node. That said, Intel Fellow and process development guru Mark Bohr quickly pointed out that transistor densities have continued to scale as expected from one generation to the next. In other words, Moore's Law is alive and well.
Source: Intel.
To illustrate, Natarajan showed how the fins comprising Intel's tri-grate transistors have grown closer together at the 14-nm node—fin pitch has been reduced from 60 to 42 nm—while the fins themselves have grown taller and thinner. The closer placement improves density, while the new fin structure allows for increased drive current and thus better performance. This higher performance, in turn, allows Intel to use fewer fins for some on-chip structures, further increasing the effective density of the process. Fewer fins also means lower capacitance and more power-efficient operation.
Source: Intel.
The gate pitch has been reduced from 90 to 70 nm and, as shown above, the spacing of the smallest interconnects has dropped even more dramatically, from 80 to 52 nm.
Source: Intel.
The cumulative result of these changes is perhaps best demonstrated by looking at a fairly common benchmark: the size of a six-transistor SRAM cell. On Intel's 22-nm process, a 6T cell occupies 0.108 square micrometers of space. The same structure at 14-nm takes up only 0.0588 square micrometers—or 54% of the area required at 22-nm. That's classic Moore's Law-style area scaling.
Source: Intel.
The benefits of the 14-nm process extend beyond sheer density. Natarajan shared the graph above to convey the power and performance advances offered by this 14-nm process. Essentially, it can flip bits at higher speeds than prior generations while losing less power in the form of leakage along the way. Intel can choose to tune its products for different points along the leakage-performance curve shown above, but in each case, chips built on the 14-nm process should offer a nicer set of tradeoffs than those from prior process generations.
This next illustration is perhaps the most telling, because it addresses one of the key threats to Moore's Law going forward: economics. I said before that the transition to each smaller process node has been more difficult than the last. Chipmakers have had to use ever more exotic techniques like double-patterning—creating two separate masks for photolithography and exposing them at a slight offset—in order to achieve higher densities. Doing so increases costs, and as a result, one of the key corollaries of Moore's Law has been threatened. If moving to finer process nodes can't reduce the cost per transistor, the march of ever-more-complex microelectronics could slow down considerably. Some chipmakers have hinted that we'll be approaching that point very soon.
Source: Intel.
By contrast, Intel says the math continues to work well for its process tech. The area per transistor is dropping steadily over time, while the cost for each square millimeter of silicon is rising at a slower pace. The net result remains a steady decrease in cost per transistor through the 14-nm node. In fact, Bohr told us that he expects Intel to deliver an even lower cost per transistor in its upcoming 10-nm process.
Despite the delays, then, Intel is bullish about its process tech advancements and confident that its 14-nm technology is ready to roll. Natarajan says the company is now shipping 14-nm production chips to its customers, and the first Core M-based products should arrive on store shelves in time for this year's holiday season. Two fabs, one in Oregon and the other in Arizona, are slated to be producing 14-nm wafers this year, with another plant in Ireland scheduled to ramp up production in 2015. Natarajan expects sufficient 14-nm silicon yields and wafer volumes to support "multiple 14-nm product ramps in the first half of 2015."